Each of the elements present in a sample produces a unique set of characteristic x-rays that is a “fingerprint” for that
specific element. XRF analyzers determine the chemistry of a sample by measuring the spectrum of the characteristic x-ray
emitted by the different elements in the sample when it is illuminated by x-rays. These x-rays are emitted either from a
miniaturized x-ray tube, or from a small, sealed capsule of radioactive material.
Radiography (or X-Ray) inspection is a universal technique used to inspect for damaged, defective or counterfeit
components and is an integral element of the inspection processes incorporated within IDEA 1010B, CCAP 101, AS5553 and
AS6081 standards. These standards and processes were created in response to a significant and increasing volume of
fraudulent/counterfeit electronic parts entering the aerospace supply chain, posing significant performance, reliability, and
X-ray inspection gives you the unique ability to “see” what is inside an electronic component without damaging it.
Visual comparison of internal construction, uniform construction, presence or absence of a die, die paddle shape and size,
lead frame size , shape, wire bond pin out and die bonding voids are some of the aspects that can be examined using our
state of the art X-RAY equipment.
BGA Test & Technology has a state of the art X-Ray system used to micro focus real-time inspection of electronic
components, multi-Layer circuit boards, sealed components and SMT assemblies. It is equipped with a 90kv, 5micron X-ray
tube, detector and positioner with image intensifier with zoom lens and CCD camera.
The X-ray equipment runs on verifier software which provides up to 64 frames of integration. Software also allows for live
averaging thus providing the best image possible during real-time motion.
Temperature Up Screening to Industrial Mil Aerospace Grade