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High-Reliability Applications Require High-Reliability Components
Mitigate Tin Whiskers & Gold Embrittlement

High-Reliability Applications
Require High-Reliability Components
Mitigate Tin Whiskers & Gold Embrittlement

Reballing
Robotic Hot Solder Dip (RHSD)
Re-tinning and Lead
Gold Embrittlement Mitigation
Counterfeit Mitigation Services
XRF Analysis
X Ray Inspection
Testing & Temperature Up-Screening
Custom Harvesting
Warehouse & Kitting Services

Terms & Conditions

Download BGA Test & Technology’s Terms & Conditions PDF files for your convenience.

Sales Terms & Conditions

PO Quality Clause

PO Terms & Conditions

ISO

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CONTACT INFO

BGA Test & Technology
20 Peachtree Ct.
Holbrook, New York 11741

Phone: 631-750-4600
Fax: 631-218-1579

Email: sales@bgatechnology.com
Web: https://bgatechnology.com

CONTACT INFO

BGA Test & Technology
20 Peachtree Ct.
Holbrook, New York 11741

Phone: 631-750-4600
Fax: 631-218-1579

Email: sales@bgatechnology.com
Web: https://bgatechnology.com

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