Robotic Hot Solder Dip


BGA Test & Technology utilizes state of the art, 6-station Robotic Hot Solder Dip (RHSD) machines for processing components. Operators can control all process parameters including:

  • Bath and Pre-heat Temperatures
  • Immersion depth
  • Dwell time
  • Insertion speed and acceleration
  • Extraction speed and acceleration

Our high volume, high mix Robotic system is designed to flux, Pre-heat, Solder Dip, and clean virtually any style package of electronic component with a Precise Repeatable Process.


Our RHSD system allows us to comply with (meet any of) the following industry standards for solder dipping/solderability.

  • GEIA-STD-0006 For Solder Dip to Replace Finish
  • ANSI-J-STD-002 Method A,B,C & D (w/wave)
  • IEC-68-2-20 Test TA, Para 4.9, & Test TB
  • IEC-68-2-58 Test TD
  • JESD22-B102D Method 1
  • JESD22A111 Method 5.6.2
  • JISZ-3198-4 Method B
  • Mil-STD-202 Method 208
  • Mil-STD-883