AS9100D & ISO9001:2015 Certified; ANSI/ESD-S20.20-2014 Certified;  ITAR Registered
Cage Code: 6EMC9

Reballing and Ball Attach Services

BGA TEST & TECHNOLOGY has developed a reliable and repeatable process, in compliance with the objectives and requirements of IEC/TS62647, for re-balling and ball attach with the capability to convert Pb-free spheres to Eutectic Solder (Sn63Pb37) or High Lead solder (Sn10Pb90) spheres for Military, Aerospace, and other High-Reliability Electronic Assemblies. This process will also work in reverse to convert tin-lead spheres to Pb-free (SAC305) spheres for many commercial applications with RoHS restrictions.

Brief Description of Process

After going through a QA gate upon arrival, incoming lots undergo the following steps:

Devices pass through the process cycle with strict quality and process control for repeatable and reliable results. Our Re-balling process has been proven to meet the requirements of ADHP (Aerospace, Defense, and High Performance) industries using the following qualification criteria:

Please contact us for more information or quote.
Experience the best

High Quality Technology

BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers.

Call Now