IPC –J-STD-001 criterion. 4.5.1 Gold Removal
Gold Shall Be Removed: N1P2D3
A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component in the
BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers.