BGA Technology and TopLine Corporation have engaged to provide Column Grid Attachment services. BGA Technology provides attachment of solder columns manufactured by TopLine, for defense, aerospace, and other applications. BGA Technology can remove solder balls from BGA components and replace with solder columns.
CGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards. Most CGA packages have large ceramic substrates 21mm to 52.5mm. CGA packages are typically 1.0mm or 1.27mm pitch.
Solder columns absorb CTE (coefficient of thermal expansion) mismatch between the IC package and the PCB circuit board. CTE mismatch is inherent due to joining different material properties between the IC package and the PCB circuit board. Stress due to CTE mismatch results in eventual delamination and catastrophic electrical failure between a large ceramic CBGA IC package and the PCB circuit board.
Solder columns (nominally 2.2mm long) provide more compliancy than solder balls to reduce stress caused by CTE mismatch. Tall solder columns absorb stress and increase solder joint reliability under harsh operating conditions.
BGA Technology provides column attachment services for Pb80/Sn20 copper wrapped solder columns as well as Pb90/Sn10 plain columns. A newly patented braided copper solder column is also available for special applications.
BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers.