Radiography (or X-Ray) inspection is a universal technique used to inspect for damaged, defective or counterfeit components and is an integral element of the inspection processes incorporated within IDEA 1010B, CCAP 101, AS5553 and AS6081 standards. These standards and processes were created in response to a significant and increasing volume of fraudulent/counterfeit electronic parts entering the aerospace supply chain, posing significant performance, reliability, and safety risks.
X-ray inspection gives you the unique ability to “see” what is inside an electronic component without damaging it.
Visual comparison of internal construction, uniform construction, presence or absence of a die, die paddle shape and size, lead frame size , shape, wire bond pin out and die bonding voids are some of the aspects that can be examined using our state of the art X-RAY equipment.
BGA Test & Technology has a state of X-Ray system used to micro focus real-time inspection of electronic components, multi-Layer circuit boards, sealed components and SMT assemblies. It is equipped with a 90kv, 5micron X-ray tube, detector and positioner with image intensifier with zoom lens and CCD camera.
The X-ray equipment runs on verifier software which provides up to 64 frames of integration. Software also allows for live averaging thus providing the best image possible during real-time motion.