BGA TEST & TECHNOLOGY
Call Us Today! 631.750.4600 | team@bgatechnology.com
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BGA TEST & TECHNOLOGY
Call Us Today! 631.750.4600 | team@bgatechnology.com
  • HOME
  • SERVICES
  • RFQ
  • CERTIFICATIONS
  • CONTACT US
  • High Reliability Applications require High Reliability Components
    Mitigate Tin Whiskers & Gold Embrittlement
  • High Reliability Applications require High Reliability Components
    Mitigate Tin Whiskers & Gold Embrittlement
Certifications
May 22nd, 2018 admin


Our Services

  • Re-Balling
  • Robotic Hot Solder Dip (RHSD)
  • Re-Tinning and Lead
  • Gold Embrittlement Mitigation
  • Counterfeit Mitigation Services
  • XRF Analysis
  • X-RAY Inspection
  • TESTING & TEMPERATURE UP-SCREENING
  • CUSTOM HARVESTING
  • Warehouse & Kitting services
  • Careers

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Contact Info

BGA Test and Technology
20 Peachtree Ct. Holbrook,
New York 11741
Phone: 631-750-4600
Fax: 631-218-1579
Email: sales@bgatechnology.com
Web: http://bgatechnology.com

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