6th Sep 2013
BGA TEST & TECHNOLOGY installs Automated Hot Solder Dipping Station capable of meeting GEIA-STD-0006.
4th Sep 2013
BGA TEST & TECHNOLOGY is approved by Lockheed Martin (Clearwater) for re-balling services & procurement of components for reballing.
2nd May 2013
BGA TEST & TECHNOLOGY is approved by Lockheed Martin (Syracuse) for re-balling services.
22nd Jan 2013
BGA TEST & TECHNOLOGY is approved by Lockheed Martin (Owego) for re-balling services.
21st Dec 2012
BGA TEST & TECHNOLOGY RECEIVES ANSI/ESD-S20.20:2007 CERTIFICATION: We are proud to announce that our organization has received ANSI/ESD-S20.20:2007 Certification accredited by ANAB.
12th Nov 2012
BGA TEST & TECHNOLOGY lands first major “Temperature Up-Screening” service contract for a large Gasoline pump manufacturer. This project is projected to run for 8-10 months.
2nd Sep 2012
BGA TEST & TECHNOLOGY has now included Temperature Up-screening of electronic components to their suite of services. Now capable of up-screening commercial (COTS) components to Industrial and Military temperature ranges.
1st Aug 2012
BGA TEST & TECHNOLOGY RECEIVES AS9100C CERTIFICATION: We are proud to announce that our organization has received our AS9100C Certification accredited by ANAB. The scope of the certification is as follows; Testing, supply chain solutions, Alteration and repair of Electronic Components. Including Re-Balling, conversion of Ball Grid Array (BGA) style devices”.
24th Aug 2011
BGA Technology is currently registered with Office Of Defense Trade Controls Compliance, Compliance and Registration Division (CRD). Registration serves as a precondition to submitting an application for an export license or other approval from the Directorate Of Defense Trade Controls (DDTC) or use of export exemptions.
1st Aug 2011
BGA TEST & TECHNOLOGY RECEIVES ISO CERTIFICATION:We are proud to announce that our organization has received our ISO 9001:2008 Certification. This certification is accredited by ANAB. The scope of the certification is as follows: Testing, supply chain solutions, Alteration and repair of Electronic Components. Including Re-Balling, conversion of Ball Grid Array (BGA) style devices.