News & Events

6th Sep 2013

BGA TEST & TECHNOLOGY installs Automated Hot Solder Dipping Station capable of meeting GEIA-STD-0006.

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4th Sep 2013

BGA TEST & TECHNOLOGY is approved by Lockheed Martin (Clearwater) for re-balling services & procurement of components for reballing.

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2nd May 2013

BGA TEST & TECHNOLOGY is approved by Lockheed Martin (Syracuse) for re-balling services.

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22nd Jan 2013

BGA TEST & TECHNOLOGY is approved by Lockheed Martin (Owego) for re-balling services.

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21st Dec 2012

BGA TEST & TECHNOLOGY RECEIVES ANSI/ESD-S20.20:2007 CERTIFICATION: We are proud to announce that our organization has received ANSI/ESD-S20.20:2007 Certification accredited by ANAB.

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12th Nov 2012

BGA TEST & TECHNOLOGY lands first major “Temperature Up-Screening” service contract for a large Gasoline pump manufacturer. This project is projected to run for 8-10 months.

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2nd Sep 2012

BGA TEST & TECHNOLOGY has now included Temperature Up-screening of electronic components to their suite of services. Now capable of up-screening commercial (COTS) components to Industrial and Military temperature ranges.

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1st Aug 2012

BGA TEST & TECHNOLOGY RECEIVES AS9100C CERTIFICATION: We are proud to announce that our organization has received our AS9100C Certification accredited by ANAB. The scope of the certification is as follows; Testing, supply chain solutions, Alteration and repair of Electronic Components. Including Re-Balling, conversion of Ball Grid Array (BGA) style devices”.

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24th Aug 2011

BGA Technology is currently registered with Office Of Defense Trade Controls Compliance, Compliance and Registration Division (CRD). Registration serves as a precondition to submitting an application for an export license or other approval from the Directorate Of Defense Trade Controls (DDTC) or use of export exemptions.

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1st Aug 2011

BGA TEST & TECHNOLOGY RECEIVES ISO CERTIFICATION:We are proud to announce that our organization has received our ISO 9001:2008 Certification. This certification is accredited by ANAB. The scope of the certification is as follows: Testing, supply chain solutions, Alteration and repair of Electronic Components. Including Re-Balling, conversion of Ball Grid Array (BGA) style devices.

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